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Single Sided PCB Assembly Services GPS Tracking For GPS Module
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Product Description
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1) With UL,ROHS,ISO,IPC
2) Lead time:3-10 working days
3) Competitive price best quality
4) High Tg Multilayer PCB .
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Technical Capability
Technical Capability(Rigid PCB)
| Technologyandnbsp;andnbsp;Parameter | 2016 |
| Max.andnbsp;Layerandnbsp;Countandnbsp; | 20Landnbsp;forandnbsp;prototype |
| 12Landnbsp;forandnbsp;massandnbsp;production |
| Baseandnbsp;material | CEM-1,CEM-3,FR4(Normalandnbsp;Tg, Highandnbsp;Tg, |
| Halogenandnbsp;Free),Alandnbsp;baseandnbsp;etc.andnbsp; |
| Finishandnbsp;Boardandnbsp;thickness | 0.40mmandnbsp;toandnbsp;4.0mm |
| Baseandnbsp;Copperandnbsp;Foil | 1/3andnbsp;ozandnbsp;toandnbsp;4andnbsp;oz |
| Min.andnbsp;Lineandnbsp;Width/Spacing | 3.0/3.0milandnbsp;(0.076/0.076mm) |
| Min.andnbsp;Mechanicalandnbsp;Drillandnbsp;Size | 0.15mm |
| Min.andnbsp;Dielectricandnbsp;(Core)andnbsp;Thicknessandnbsp; | 2mil(0.05mm) |
| Aspectandnbsp;Ratioandnbsp; | 12:01 |
| Impedanceandnbsp;Controlandnbsp; | 8% |
| Blindandnbsp;Via/Buriedandnbsp;Via | Yes |
| HDIandnbsp;Capability | 2+N+2 |
| Surfaceandnbsp;Finish | HAL,HALandnbsp;(Lead-free),OSP, Immersionandnbsp;Gold, |
| Immersionandnbsp;Tin, Immersionandnbsp;Silver, Selectiveandnbsp;Goldandnbsp;Platingandnbsp; |
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Technical Capability(FPC)
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| Technologyandnbsp;andnbsp;Parameter | 2016 |
| Max.andnbsp;Layerandnbsp;Countandnbsp; | 20Landnbsp;forandnbsp;prototype |
| 12Landnbsp;forandnbsp;massandnbsp;production |
| Baseandnbsp;material | CEM-1,CEM-3,FR4(Normalandnbsp;Tg,Highandnbsp;Tg, |
| Halogenandnbsp;Free),Alandnbsp;baseandnbsp;etc.andnbsp; |
| Finishandnbsp;Boardandnbsp;thickness | 0.40mmandnbsp;toandnbsp;4.0mm |
| Baseandnbsp;Copperandnbsp;Foil | 1/3andnbsp;ozandnbsp;toandnbsp;4andnbsp;oz |
| Min.andnbsp;Lineandnbsp;Width/Spacing | 3.0/3.0milandnbsp;(0.076/0.076mm) |
| Min.andnbsp;Mechanicalandnbsp;Drillandnbsp;Size | 0.15mm |
| Min.andnbsp;Dielectricandnbsp;(Core)andnbsp;Thicknessandnbsp; | 2mil(0.05mm) |
| Aspectandnbsp;Ratioandnbsp; | 12:01 |
| Impedanceandnbsp;Controlandnbsp; | 8% |
| Blindandnbsp;Via/Buriedandnbsp;Via | Yes |
| HDIandnbsp;Capability | 2+N+2 |
| Surfaceandnbsp;Finish | HAL,HALandnbsp;(Lead-free),OSP, Immersionandnbsp;Gold, |
| Immersionandnbsp;Tin, Immersionandnbsp;Silver, Selectiveandnbsp;Goldandnbsp;Platingandnbsp; |
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andnbsp;PCB Assembly files requests
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1. Gerber files of the PCB Boardandnbsp;
2. BOM(Bill of material) for assemblyandnbsp;
3. To short the lead time, please kindly advertise us if there is any acceptable components substitution.andnbsp;
4. Testing method andamp; Test fixtures if necessary.andnbsp;
5andnbsp; programming files andamp; programming tool if necessaryandnbsp;
6. Schematic if necessary
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Packing andamp; Shipping
andnbsp;Packaging and Marking mode of the above mentioned way is the usual way. If there is a need to increase and change according to customerand#39;s specific requirements.
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The PCB factory which we cooperated has more than 14 yearsandnbsp;of Experience in PCB Industry,
There are more than 600 employees and four factories; one factory for prototypes, one for mass production, one for aluminum and copper PCBs, and one for PCB assembly. Each factory has the ability to make 8,000 square meters per month and we offer 1,000 kinds of PCB fabrication monthly, including one- to 20-layer PCBs, HDI, aluminum, heavy copper and halogen-free PCBs.
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we haveandnbsp;Double-sided cooperation with the PCB factory,our company offer them a series electronic components and other parts for BOM, and we make PCB and assembly there.so both of us can get veryandnbsp;competitive price.
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With the powerful support from the partner, weandnbsp;Have confidenceandnbsp;to give our customers best service.
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